Development Products

Epoxy Resin

Development and Manufacturing of Epoxy Resin

We started entrusted manufacturing of epoxy resins used for carbon fiber reinforced plastics (CFRP) intended for the Boeing 787 in 2004. Taking the opportunity of full-scale manufacturing, we started development of wide-ranging epoxy resins for applications, including electronic materials and adhesive agents, by taking the advantage of our synthesis technologies we accumulated over the years.

Products

We are advancing the development of high heat-resistance epoxy resins by using chemical compounds that have the diphenyl sulfone structure owned by our company. For the first step, we succeeded in manufacturing the scale-up prototype of 3,3'-diaminodiphenyl sulfone epoxy resin (TG3DAS) and started the sample work.

TG3DAS

CAS
Registry No.78542-64-0
ENCS
New Chemical Substance

Tetraglycidyl - 3,3' - diamino diphenyl sulfone

Tetraglycidyl-3,3-diamino diphenyl sulfone

Basic Properties
<
Test value
Appearance Transparent yellow flake
Volatile portion 0.2% or below
Epoxy equivalent 136±6
Hydrolyzable Cl 1,000 ppm or below
Curing Properties
TG3DAS TGDDM Remarks
Appearance of cured material  
Grass transition temperature (°C) 250 260 TMA 2nd RUN
Average linear expansion coefficient (ppm/°C)
< Tg
> Tg
40
50
170
45
60
170
(40~80℃)
(100~180℃)
(275~285℃)
Bending strength (MPa) 110 160  
Flexural modulus (GPa) 4.3 3.2  
Hardness (Shore D) 92 90  
Curing conditions Compound ratio Epoxy/Hardener=100/40(phr)
120℃×1hr+150℃×2hr+180℃×3hr  
Compound ratio Epoxy/Hardener=100/45(phr)
120℃×1hr+150℃×2hr+180℃×3hr
 
TGDDM=Tetraglycidyl -4,4'-diaminodiphenylmethane

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