Epoxy resin
Development and production of epoxy resin
In 2004, we started contract manufacturing of epoxy resin used for carbon fiber composite material (CFRP) for Boeing 787.
Taking advantage of the synthetic technology accumulated over the years with this production,
we have begun to develop a wide range of epoxy resins such as electronic materials and adhesives.
About the product
We are developing highly heat-resistant epoxy resins using compounds possessing our own diphenylsulfone skeleton.
First, we succeeded in the scale-up trial of 3,3'-diaminodiphenylsulfone epoxy resin (TG3DAS) as the first step, and started sample work.
TG3DAS
CAS RN®
Registry No.78542-64-0
ENCS
New chemical substances
Tetraglycidyl - 3,3' - diamino diphenyl sulfone
Basic physical properties
| Test value | |
|---|---|
| appearance | Yellow transparent flakes |
| Volatile matter | 0.2% or less |
| Epoxy equivalent | 136±6 g/eq. |
| Hydrolyzable CI | 1000ppm or less |
Cured physical properties
| TG3DAS | TGDDM | Remarks | |
|---|---|---|---|
| Cured product appearance |
|
|
|
| Glass transition temperature(℃) | 250 | 260 | TMA 2nd RUN |
| Average coefficient of linear expansion(ppm/℃) < Tg > Tg |
40 50 170 |
45 60 170 |
(40～80℃) (100～180℃) (275～285℃) |
| Bending strength(MPa) | 100 | 160 | |
| Flexural modulus(GPa) | 4.3 | 3.2 | |
| Hardness(Shore D) | 92 | 90 | |
| Curing conditions | Mixing ratio ＴＧ３ＤＡＳ：ＤＤＳ＝１００：４０（Parts by weight） 120℃×1hr＋150℃×2hr＋180℃×3hr | Mixing ratio ＴＧＤＤＭ：ＤＤＳ＝１００：４５（Parts by weight） 120℃×1hr＋150℃×2hr＋180℃×3hr |
Benzoxazine resin
What’s Benzoxazine?
Oxazine resin formed by thermal ring-opening polymerization of oxazine compounds
is a new thermosetting resin that has excellent flame retardancy,
dimensional stability, low water absorption, low dielectric constant and heat resistance,
and does not generate by-product gas during molding. It is attracting attention.
We have succeeded in scaling up DHDPM (dihydroxydiphenylmethane) type benzoxazine,
and are implementing sample work.
We are also developing a DHDPS (dihydroxydiphenylsulfone) type benzoxazine that can be cured at a
lower temperature with higher heat resistance. In addition,
various structural designs are possible by combining various phenols and amines,
and we propose benzoxazine compounds according to customer requirements.
Heat causes the oxazine ring to open, producing a phenolic hydroxyl group and polymerizing.
Characteristic
- Dimensional stability
- Heat-resistant
- Flame retardance
- Electrical insulation
An excellent cured product can be obtained!
- [Application example]
- adhesive Printed board Matrix resin etc.
Structural formula of benzoxazine
* This is a representative skeleton and the product is a mixture.
BF-BXZ Stage：Pilot
X= CH2
Typical quality Adhesive solvent ≦ 2%
Aniline≦ 2%
BS-BXZ Stage：Laboratory
X= SO2
Typical quality Adhesive solvent ≦ 2%
Aniline≦ 2%
Solubility of benzoxazine
| Solvent type | BS-BXZ | BF-BXZ | |
|---|---|---|---|
| Halogenated hydrocarbon | Chloroform | ○ | ○ |
| Ether type | Propylene glycol monomethyl ether acetate | ○ | ○ |
| Ester | Ethyl acetate | ○ | ○ |
| Aprotic polar solvent system | N, N-dimethylformamide | ○ | ○ |
| Ketone system | Methyl isobutyl ketone | ○ | ○ |
| Aromatic hydrocarbon | toluene | × | ○ |
| Aliphatic hydrocarbon | Hexane | × | × |
| Alcohol | Butanol | × | × |
| water | water | × | × |
| Method:Add 2ml of solvent to 0.5g of BXZ and confirm solubility at room temperature. Those that dissolve are marked with ○, and those that are insoluble are marked with ×. | |||
Exothermic behavior during curing(BF-BXZ)
Exothermic behavior during curing(BS-BXZ)
Thermogravimetric analysis(TGA)
| BS-BXZ | BF-BXZ | |
|---|---|---|
| 5% weight loss temperature（Td5） | 367℃ | 337℃ |
| Residual charcoal rate（550℃） | 76% | 54% |
Measurement condition
| Used equipment | TG/DTA6200 |
| Measurement temperature | 30～300℃ |
| Heating rate | 10℃/min |
| flow | flow 150ml/min |
| After 1stRUN under this condition, naturally cool down, change the measurement temperature to 30 ~ 600℃, perform 2ndRUN, read the weight loss-5% temperature and the remaining 550℃. | |